PU binder for high temperature floor tile and coiled material

Application :Pu one component adhesive for mold type high temperature floor tile, floor mat and coil processing products,it is used for laying the ground of gym, kindergarten and other places

Features:Good adhesion and high strength

Item

Addition amount (%)

Mold temperature(℃)

Vulcanization time

(min)

Tensile strength (Mpa)

Bongation at break

(%)

Tear strength (KN/M)

DN1680

4-10

150

3

3

200

10

DN1670

4-10

150

3.5

2.5

170

9

DN1673

4-10

150

3

3.5

210

15

DN1270

4-10

150

5

2.5

175

10


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